Ipc-7095 Pdf =link= Here

If you are involved in PCB design or manufacturing, you’ve likely encountered the standard. Titled "Design and Assembly Process Implementation for BGAs,"

is the industry standard titled “Design and Assembly Process Implementation for BGAs.” It serves as a critical guideline for anyone involved in the manufacturing and design of electronic assemblies utilizing Ball Grid Array (BGA) and Land Grid Array (LGA) packages. ipc-7095 pdf

Compare your current land pattern (pad size) to the nominal, IPC-7095-recommended, and IPC-7095 minimum sizes. Most failures occur because designers use a pad that is too large (causing self-centering issues) or too small (causing head-in-pillow defects). If you are involved in PCB design or